Pakistan Technology News API

{
    "totalArticles": 167612,
    "articles": [
        {
            "id": "c91a418890ebc11179797603b1e7afe1",
            "title": "AMD's Zen 7 'Grimlock' CPUs will reportedly utilize TSMC's 1.4nm 'A14' node and advanced packaging",
            "description": "The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along with next-gen 3D V-Cache.",
            "content": "New information has surfaced about AMD's future Zen 7 architecture, and it is coming straight from Taiwanese supply chain sources. According to Commercial Times Taiwan, AMD has proactively begun preparations for its next-generation Zen 7 platform wel... [1910 chars]",
            "url": "https://www.tweaktown.com/news/111809/amds-zen-7-grimlock-cpus-will-reportedly-utilize-tsmcs-1-4nm-a14-node-and-advanced-packaging/index.html",
            "image": "https://static.tweaktown.com/news/1/1/111809_744_amds-zen-7-grimlock-cpus-will-reportedly-utilize-tsmcs-1-4nm-a14-node-and-advanced-packaging_full.jpg",
            "publishedAt": "2026-05-25T19:50:06Z",
            "lang": "en",
            "source": {
                "id": "88d2c803bf7465094b81545571a67996",
                "name": "TweakTown",
                "url": "https://www.tweaktown.com"
            }
        },
        {
            "id": "2f58822d45fb4d220b52832d04c65549",
            "title": "Galaxy Z Fold 8 rumors throw 'Ultra' into the mix, and it's got our heads spinning",
            "description": "Rumors suggest Samsung might mix up the branding this year.",
            "content": "What you need to know\nA rumor online claims that Samsung might switch up the branding titles for its Galaxy Z Fold 8 this year by adding an \"Ultra\" tag.\nA tipster's post suggests Samsung could give the \"regular\" Fold 8 the Ultra tag, and offer the \"G... [2794 chars]",
            "url": "https://www.androidcentral.com/phones/samsung-galaxy/galaxy-z-fold-8-rumors-throw-ultra-into-the-mix-and-its-got-our-heads-spinning",
            "image": "https://cdn.mos.cms.futurecdn.net/iyhNwQFDYkgxESLWkv3E3T-2560-80.jpg",
            "publishedAt": "2026-05-25T18:28:15Z",
            "lang": "en",
            "source": {
                "id": "b00e641d6883a868c83efd64618ae881",
                "name": "Android Central",
                "url": "https://www.androidcentral.com"
            }
        },
        {
            "id": "3d88198bcdbfc928384610108f5a566a",
            "title": "Huawei’s Kirin 9050 Is Rumored To Outperform Apple’s A18 Pro, Will Utilize A New “Stacking” Technology To Bypass Older Node Limitations",
            "description": "The Kirin 9050 arriving later this year is rumored to beat the A18 Pro and is expected to use a new 3D IC package to improve performance",
            "content": "China’s largest semiconductor manufacturer, SMIC, is currently hindered by its failure to acquire advanced EUV machinery to mass produce wafers on the 5nm lithography or below. With no alternative to scale past this limitation, the need for innovatio... [2039 chars]",
            "url": "https://wccftech.com/huawei-kirin-9050-breakthrough-3d-ic-design-beats-a18-pro/",
            "image": "https://cdn.wccftech.com/wp-content/uploads/2026/05/Kirin-9010.jpg",
            "publishedAt": "2026-05-25T16:35:00Z",
            "lang": "en",
            "source": {
                "id": "e14b8962a44ea9ad284e0c9c59374414",
                "name": "Wccftech",
                "url": "https://wccftech.com"
            }
        }
    ]
}